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From ultra-miniaturized custom packaged surface mount and hybrid circuits to chassis and rack mount designs, our innovative electronics packaging engineers have the experience and knowledge required to solve the most complex packaging problems. Our design staff does more than just design; they are also experts in the various electronics packaging processes, many of which are capabilities maintained in-house. The combined knowledge of design and process engineering allows our designers and engineers to quickly converge upon manufacturable, optimized packaging concepts that push the limits of packaging technology. With over 20 years of experience designing custom cutting-edge electronics package designs, ITT IIW has the proven experience required to design the most challenging electronics packages.
We are experienced in:
- Machine design
- Electronics packaging design (Levels 1, 2, 3)
- Solid modeling
Packaging miniaturization is a key capability of IIW. Many of our products consist of ultra-miniaturized packages. Our design process allows us to deal with the extremely small size of components and keep up-to-date with current technology. In many instances, we have taken bread-board designs and re-packaged them into overmolded hybrid circuits packing.
We design packaging at the component, board, and system levels.
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At IIW, product verification is implemented in the design phase. The environmental conditions under which our products operate impose structural and thermal loads upon the mechanical package and the electronics housed within. The design phase includes verifying our designs by analysis so that improvements can be made early in the process before costly prototyping and testing has begun.
The analyses we perform include:
- Static and Dynamic Structural Analyses (ANSYS® Mechanical™)
- Dynamic Non Linear Impact Analyses (ANSYS® LS-DYNA®)
- Fluid Dynamics and Thermal Analyses (CFdesign®)
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ITT IIW maintains a strong foothold in state-of-the-art technology, including micro and nano electromechanical systems (MEMS and NEMS), in order to offer our customers cutting-edge solutions for the most challenging problems. These efforts in the micro/nano world can also lead to more cost effective alternatives with better performance compared to existing products. MEMS and NEMS work within IIW is geared towards sensors and integration of those devices within their final environment. Specific capabilities include:
- Design and modeling of MEMS/NEMS using 3D finite element software and CAD tools
- Process design and development
- Sensor system integration via off-the-shelf and/or custom packaging
- Electrical, mechanical, and system level testing for development and production phases
- Prototype and production level fabrication consulting
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