Microelectronics Manufacturing

Click on an item below for more information on IIW's capabilities.

PCB Manufacturing

IIW has capabilities in-house to manufacture complex, multilayered printed circuit boards (PCBs) in a low-volume, quick-turn fashion. The PCBs are typically 6" x 6" with a working area of 4" square. We have relationships with several vendors that can increase the panel size to 8" x 20" with a working area of 6" x 18".

PCB design features include:

• Through-vias as small as 6.3 mils in diameter
• Blind vias as small as 6 mils diameter
• Traces/spaces as narrow as 2.5 mils at the pinch points
• Board materials as thin as 2 mils
• Cavity fabrication
• Complex panel routing

We use a variety of board materials — such as high-Tg FR-4, polyimide, aramid, and fluoropolymer — and processing techniques to provide tailored electrical performance, as well as control of mechanical properties, such as Thermal Coefficient of Expansion (TCE).

We manufacture multilayer PCBs containing four metal layers and three dielectric layers using a simultaneous lamination technique, and use a sequential build-up technique for PCBs containing many more layers.

SMT Integrated Manufacturing Assembly

IIW utilizes state-of-the-art Surface Mount Technology (SMT). We have a full SMT line consisting of pick-and-place equipment that guarantees high speed and accurate placement of all types of SMT components, as well as a 7-zone convection oven for convection solder reflow.

Component placement capabilities include:

• Ball Grid Array (BGA)
• Flip Chip
• Chip-on-board
• Micro BGAs

IIW employs J-STD-1 certified instructors and solderers, and our manufacturing services include:

• World-class design-for-manufacturability (DFM) consultation
• Material specification, procurement, and management
• PCB assembly
• Box assembly
• Test and packaging

Chip and Wire Assembly

IIW has a long history and strong expertise in a variety of Chip and Wire assembly processes. Listed below are a few of our specialties.

• Die and wafer processing
  • Multiple material die thinning ≤ 6 mil
  • Multiple material die polishing
  • Wafer and substrate dicing ≤ 6"
  • Large wafer grinding/dicing consultation
     
• Die reclaim
  • Lead frame and BGA packaged die reclaim
  • Reclaim die thinning/polishing
  • Flip chip reclaim
  • Flip chip reball consultation
     
• MRSI fully automated die pick-n-place
  • Die, die-stack, SMT adhesive stamping
  • Die stacking and SMT placement
  • Custom chip placement (e.g., air bridges)
  • Flip chip flux-dip, underfill, and placement
  • Organic, ceramic, flex, etc., substrate materials
  • Pattern-to-pattern accuracy ±2 µm
  • Chip size .3 mm to 25 mm
     
• Automatic thermosonic gold ball bonding
  • Wire size 0.7 - 1.0 mil (18 - 25 µm)
  • Minimum bond pad pitch to 51 µm
  • Placement accuracy of ±4 µm
  • Security bump looping
  • Stand-off stitch bond (SSB and MSB) looping
  • Reverse bonding
  • Tamping/coining of reclaimed die
  • Die-to-die bonding
  • Dry and wet cleaning capability
     
• Automatic aluminum wedge bonding with 1.25 mil wire
  • Wire size 0.8 - 1.25 mil (20 - 32 µm)
  • Minimum bond pad pitch to 60 µm
     
• Hybrid encapsulation
  • Custom encapsulation shapes
  • Thin wall encapsulation for minimum height (down to 1 mil)
  • Extreme draft angles for minimum footprint
     
• Qualification
  • Wire pull and statistic generation
  • Ball shear and statistic generation
  • Die adhesive analysis (push-out, bleed, shear strength)
  • Reclaim die interconnect analysis
  • Hot gas die removal system
  • In-process hybrid electrical testing